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Flip chip
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41	• l . SILICON MULTICHIP MODULES Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-27 22:44:07 Semiconductor device fabrication Electronics manufacturing Multi-chip module Integrated circuit Printed circuit board Flip chip Wire bonding Capacitor Quad Flat Package Electronics Electronic engineering Electromagnetism
42	Market Trend with Packaging Technology Add to Reading List Source URL: www.hotchips.org Language: English - Date: 2013-07-28 00:29:56 Integrated circuits Microtechnology Three-dimensional integrated circuit Ball grid array Quad-flat no-leads package Chip scale package Interposer Amkor Technology Flip chip Semiconductor device fabrication Electronics Electronic engineering
43	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-13 17:05:57 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
44	FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM 3D S YS TEM INTEGRATION TS V INTERPOS ER Silicon interposers with through silicon vias (TSVs) are an important element for the realization of 3D system-in-pa Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-11 11:27:45 Materials science Wafer Three-dimensional integrated circuit Microelectromechanical systems Through-silicon via Flip chip Fraunhofer Society Die preparation Semiconductor device fabrication Microtechnology Electronics
45	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-02 11:52:26 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
46	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M Fraunhofer IZM – ASSID All Silicon System Integration Dresden All Silicon System Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-01 11:41:42 Technology Three-dimensional integrated circuit Wafer Through-silicon via Fraunhofer Society Fraunhofer Group for Microelectronics Integrated circuit Flip chip Semiconductor device fabrication Electronics Microtechnology
47	F R A U N H O F E R I N S T I T U T E F o R R e l ia b i l it y an d M i C roin T e g ration I Z M DEPARTMENT OF High Density Interconnect & Wafer Level Packaging Add to Reading List Source URL: www.izm.fraunhofer.de Language: English - Date: 2015-04-08 16:24:43 Technology Wafer-level packaging Microelectromechanical systems Wafer Three-dimensional integrated circuit Chip scale package Integrated circuit Flip chip Etching Semiconductor device fabrication Electronics Microtechnology
48	High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market Russell Shumway Director- MEMS & Sensor Products Office: Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:45:23 Semiconductor device fabrication Electrical engineering Mechanical engineering Microelectromechanical systems Transducers Wafer bonding Flip chip Deep reactive-ion etching Amkor Technology Materials science Technology Microtechnology
49	「維基夥伴獎學金」獎助生成果報告書簡報檔 Backside Via Hole and Flip-Chip Packaging of GaAs MMICs for W-Band Applications 應用在w-band之GaAs MMICs的背面導通孔與覆晶技術 Add to Reading List Source URL: diamondprj.nctu.edu.tw Language: English - Date: 2015-03-31 23:23:48 PTT Bulletin Board System Taiwanese culture Xiguan
50	Thermal Analysis for 3D Integration GSA OctGene Matter, VP Application Engineering, DOCEA POWER © DOCEA Power - Confidential Add to Reading List Source URL: www.gsaglobal.org Language: English - Date: 2014-01-22 10:42:09 Electromagnetism Semiconductor device fabrication Three-dimensional integrated circuit Ball grid array Flip chip Network On Chip Electronics manufacturing Electronic engineering Electronics Integrated circuits